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| GaAs Flip Chip Schottky Diodes Features Single - DMK2783-000, DMK2790-000 I Designed for High Volume Designs I High Frequency (20-100 GHz) I Exceeds Environmental Requirements for MIC & Hybrid Applications I Designed for Low Junction Capacitance and Low Series Resistance I Applications Include PCN Mixers and Circuits, As Well As Low Power, Fast Switching I Low Parasitic Flip Chip Configuration Series Pair - DMK8001-000 Anti-Parallel - DMK2308-000 Description This new series of GaAs Schottky barrier diodes offer high performance at commercial market prices. They are designed for low junction capacitance, as well as low series resistance. Diodes are designed for MIC work (hard and soft substrates), but the leadless design eliminates the problems associated with mounting of beam lead diodes. Due to its rigid construction, it exceeds environmental requirements for MIC and hybrid applications. Diodes can be supplied on expandable film frame for high speed pick and place process. Standard packing will be in a gel pack. Flexible conductive epoxy is the most effective method for circuitry attachments. Standard mounting temperatures should not exceed 175C. Electrical Specifications at 25C Recommended Frequency (GHz) VB1 @ 10 A (V) CT2 0 V, 1 MHz (pF) Min. 20-100 20-100 20-100 3.0 3.0 3.0 0.03 0.04 0.05 Max. 0.05 0.07 0.08 RS @ 10 mA () Max. 9 7 7 VF @ 1 mA (mV) Min. 680 650 650 Max. 780 750 750 Single 540-011 DMK2783-000 DMK2790-000 DMK8001-000 DMK2308-000 Series Pair 540-012 Anti-Parallel 540-025 1. VB cannot be measured nondestructively in anti-parallel configuration. 2. CT = junction capacitance plus 0.02 pF (overlay). Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 3/00A 1 GaAs Flip Chip Schottky Diodes Typical Parameter Distribution on Wafer 0.080 0.076 0.072 0.068 0.064 0.060 0.056 0.052 0.048 0.044 0.040 0.036 0.032 0.028 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 65 60 55 50 45 40 35 30 25 20 15 10 5 0 680 Device Capacitance (pF) Number of Obs VF = Mixer DMK2790 x = 719 mV = 6.3 mV 700 720 740 Bias Voltage (V) VF 1 mA (mV) Capacitance/Voltage Variation Aug 0.063 pF SD = 0.002 pF 60 55 50 45 40 35 30 25 20 15 10 5 0 0.055 Histogram 165 x = 5.0 = 0.25 154 143 132 121 110 99 88 77 66 55 44 33 22 11 0 4.0 4.5 Number of Obs 0.060 0.065 0.070 Number of Obs CJ 0.0063 pF Average 0.0014 pF SD RT = Mixer DMK2790 x = 5.0 = 0.25 5.0 5.5 6.0 Capacitance 0 V (pF) RT 10 mA () Histogram Histogram Spice Parameters (Per Junction) IS Amp 0.5 E-12 RS 4 n 1.05 TD S 1E-11 CJ0 pF 0.05 m 0.26 EG eV 1.43 VJ eV 0.82 XTI 2 FC 0.5 BV V 4.0 IBV A 1E-05 2 Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 3/00A GaAs Flip Chip Schottky Diodes Suggested Setup Values For WEST-BOND Model 7200A Epoxy Die Bonder Materials Epoxy Microelectronic grade one component, solvent-free silver-filled, electrically conductive adhesive -- example: Ablebond 8380 by Ablestick. Dispense Tube WEST-BOND B-1831-1 with 9.5 mil I.D., or WEST-BOND B-1831-2 with 15.5 mil I.D. Other sizes available. Die Pickup Tool SPT Part Number 2101-W625-CT-031 x 0.016 x 0.0075. Hole diameter 0.016" face diameter 0.031", O.D. 0.625". Use vacuum pressure to pick and place chip. Adjustment Bond Force 35 grams at tool. Dispense Air 30 psi. Dispense Time To give diameter of dot required. Curing Time Temperature 250C 130C 100C 85C Time 10 min. 20 min. 60 min. 120 min. Flexible Conductive Epoxy Mounting of Alpha Beamless Flip Chip Diodes - To Soft or Hard Substrate - As Plated 10 Mil Gap Conductive Epoxy Drops (Minimum Amount) Approximately 8 mil Diameter 1-2 mil height Deposit Conductive Epoxy Perform Die Attach * Flip Device * Align Bond Pads to Epoxy Dot (Alignment Marks Help) * Use Even Pressure to Make Correct Connection Acceptable Epoxy Runout Excessive Epoxy Runout Cure Epoxy & DC Continuity Check * Inspect for Adequate Epoxy Fillet * Cure According to Mfg. Preferred Schedule. Typically 110-150C @ 60 Minutes, or 150C, 4 Minutes for Snap-Cure Epoxies Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 3/00A 3 GaAs Flip Chip Schottky Diodes Outline Drawings 540-011 0.026 (0.66 mm) 0.001 (0.025 mm) 0.008 (0.20 mm) 0.001 (0.025 mm) 0.005 (0.13 mm) 0.001 (0.025 mm) 0.005 (0.13 mm) 0.001 (0.025 mm) MAX. 0.013 (0.33 mm) 0.001 (0.025 mm) 0.013 (0.33 mm) 0.001 (0.025 mm) 540-025 0.026 (0.66 mm) 0.001 (0.025 mm) 0.008 (0.20 mm) 0.001 (0.025 mm) 0.005 (0.13 mm) 0.001 (0.025 mm) 0.013 (0.33 mm) 0.001 (0.025 mm) 0.013 (0.33 mm) 0.001 (0.025 mm) 0.005 (0.13 mm) 0.001 (0.025 mm) MAX. 540-012 0.005 (0.127 mm) 0.001 (0.025 mm) TYP. 0.008 (0.203 mm) 0.001 (0.025 mm) TYP. 0.020 (0.508 mm) 0.001 (0.025 mm) C L CATHODE LEAD 3 SCHEMATIC 0.010 (0.254 mm) 0.001 (0.025 mm) 0.005 (0.127 mm) 0.001 (0.025 mm) 1 2 1 2 C L 0.009 (0.229 mm) 0.001 (0.025 mm) 0.019 (0.483 mm) 0.001 (0.025 mm) 3 0.009 (0.229 mm) 0.001 (0.025 mm) 0.028 (0.711 mm) 0.001 (0.025 mm) 0.005 (0.13 mm) 0.001 (0.025 mm) MAX. 0.014 (0.356 mm) 0.001 (0.025 mm) 4 Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 3/00A |
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